High-end professional materials help high-power devices release their potential

Multilayer heat sink is made of multilayer composite materials such as CPC（Cu-MoCu-Cu）、CMC（Cu-Mo-Cu）etc.

High thermal conductivity and adjustable CTE.

Widely meet the heat dissipation requirements of the third generation semiconductor packages.

Apply on semiconductor laser packaging for heat dissipation.

Small volume, high heat exchange efficiency and less coolant consumption.

Diamond copper heat sink is a composite of copper and diamond particle.

Super high thermal conductivity，low CTE and resistance.

Thermal conductivity can reach up to above 800W/m·K.

Good thermal shock resistance.

Excellent thermal conductivity, bending strength and high temperature resistance.

The reliability and consistency of products have been recognized by international brands.

The product matrix covers Si3N4, ZTA and Al2O3, which can be customized.