World leading performance, and mass-production in key customers at home and abroad.
Self-developed packaging materials feature low cost and high reliability.
The 3rd generation compound semiconductor.
High performance product solution can be applied to terminal device such as base station drive.
Super junction technology, low switching loss, thin chip, high working frequency.
High power density and high efficiency can be achieved.
High reliability and high efficiency Kelvin structure packaging.
Low stray inductance, flexible design, for Photovoltaic and Inver.
Flexible different vehicle grades for the needs of renewable energy vehicle customers.
Apply on semiconductor laser chip packaging heat dissipation.
Apply on semiconductor laser chip packaging heat dissipation,Small volume.
Low resistance &amp; thermal expansion, super high thermal conductivity.
The reliability and consistency of products have been recognized by international brands.
Provide RF core device, has an international leading self-developed LDMOS process.
Provide reliable, efficient and high quality next-generation power semiconductors, shorten developme
Provide high quality industrial semiconductor products. Make automation design as simple, efficient
Provide innovative automotive semiconductor solutions for key automotive electronic systems. Watech
Buck-Boost PMIC by Watech enables high-performance and low-cost HPUE solution for smart phone, RF mo
Based on LDMOS technology, high power and high robustness are achieved. In 2010 Watech began to rese
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